Thermal pads are flexible thermally conductive materials designed to improve heat transfer between electronic components and cooling systems. Their role is to fill gaps and surface irregularities caused by roughness or texture of contacting parts, ensuring better heat dissipation, component protection, stable device performance, and longer service life.
Effective Heat Dissipation from Components
IPT thermal pads efficiently conduct heat from active components (e.g., processors, batteries, LEDs) to radiators or cooling elements, reducing the risk of overheating and system failure.
Perfect fit for demanding applications
Due to their soft structure and wide hardness range, thermal pads perfectly fill porous surfaces and irregularities, compensating for mechanical stress and preventing thermal voids.
FAQ
Silicone pads are highly elastic, heat-resistant, and stable over time. Acrylic pads provide stronger mechanical resistance and are suited for harsher environments with moisture exposure.
Thickness depends on the gap size and the need for stress compensation. Larger gaps require thicker pads, but proper compression (20–40%) is key for optimal heat transfer.
In automotive: EV batteries, energy converters, and control modules. In electronics: laptops, LED modules, PCBs, and memory units.
Moderate compression reduces thermal resistance by improving surface contact. Excessive compression may reduce efficiency – always follow the manufacturer’s pressure guidelines.
Maximum continuous operating temperature, dimensional stability, hardness (Shore), and elongation at break. Silicone or enhanced acrylic formulations are recommended above 120 °C.
See also
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See also
